Process for producing microelectromechanical components and a housed microelectromechanical component

ABSTRACT

A process produces microelectromechanical components from a substrate that has a first side and a second side which is substantially opposite from the first side, and at least the first side has at least one microelectromechanical element. The process includes the step of providing at least one conductive passage into the substrate, connecting the first side to the second side, and securing at least one support to the first side of the substrate, with the at least one electrically conductive passage uncovered by thinning the substrate material with the mechanical stability being ensured by the support.

CROSS-REFERENCES TO RELATED APPLICATIONS

This is a Continuation Application of pending U.S. patent applicationSer. No. 10/228,804 filed Aug. 26, 2002 of the same inventors, whichclaims priority of the following German Applications: DE 101 41 571.0filed on Aug. 24, 2001; DE 101 41 558.3 filed on Aug. 24, 2001, and DE102 22 959.7, filed on May 23, 2002.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not applicable.

BACKGROUND OF THE INVENTION

The invention relates to a process for producing microelectromechanicalcomponents and to a housed microelectromechanical component. Inparticular, the invention relates to a process for producing housedmicroelectromechanical components joined to the wafer with a structuredsupport, and to a housed microelectromechanical component with astructured support.

TECHNICAL FIELD

Microelectromechanics is nowadays considered to be one of the keytechnologies. There are numerous potential and existing applications formicroelectromechanical systems (MEMS) in sensor technology, optics andcommunications technology. For example, MEMS components have alreadybeen in use for a number of years as acceleration sensors for airbags inthe automotive industry. According to a market research study carriedout in 2002 by NEXUS, the European Marketing Organization for MEMSProducts, annual growth rates of 20% are likely in the MEMS industry.

However, MEMS modules often have the problem that the spatialarrangement of the contacts makes them have an adverse effect on thefunction of the mechanical components of the MEMS module. In general,the micromechanical structures are on the same side of a module as itselectrical connections. Particularly in the case of MEMS modules withoptical functions, however, the connections have to be laid on a sidewhich is opposite from the side with the micromechanical elements, sothat the micromechanical elements are not covered, for example, when thearrangement is secured to a circuit board. For this purpose, thecontacts are generally led laterally around the microelectromechanicalcomponent in the housing of the module. A particular drawback of this isthat this type of contact takes up very large amounts of space and istherefore an obstacle to miniaturization. Moreover, contact of this typerequires the components to be separated in order to allow contacts to beguided around them. Accordingly, this method is also unsuitable forcarrying out while the components are still joined to the wafer.

SUMMARY OF THE INVENTION

Therefore, the invention is based on the object of eliminating or atleast alleviating the abovementioned drawbacks in MEMS components andduring their production. This object is achieved, in a surprisinglysimple way, by a process for producing microelectromechanical componentsfrom a substrate having a first side and a second side which issubstantially opposite from the first side, at least the first sidehaving at least one microelectromechanical element, comprising the stepof providing at least one electrically conductive passage into thesubstrate, connecting the first side to the second side and the step ofsecuring at least one support to the first side of the substrate,wherein the at least one electrically conductive passage 8 is uncoveredby thinning the substrate material with the mechanical stability beingensured by means of the support. The object is also achieved by amicroelectromechanical component comprising a substrate having a firstside and a second side which is substantially opposite from the firstside, at least the first side comprising at least onemicroelectromechanical element and at least one support which isconnected to the first side of the substrate, wherein the substrate hasat least one electrically conductive passage, connecting the first sideto the second side, and the substrate is thinned, the mechanicalstability of the thinned substrate being ensured by means of thesupport.

According to the invention, a microelectromechanical component isproduced from a substrate having a first side and a second side which issubstantially opposite from the first side, at least the first sidehaving at least one microelectromechanical element, as a result of atleast one conductive passage, which connects the first side to thesecond side, being introduced into the substrate. In this way, theprocess according to the invention creates an electrically conductiveconnection between the first and second sides of the substrate.Therefore, the contacts for the microelectromechanical elements can belaid on the opposite side of the substrate from the elements, which is aparticularly space-saving arrangement.

Furthermore, the process preferably comprises the step of securing atleast one support to the first side of the substrate. The order of theprocessing steps of securing the support and introducing the conductivepassage is not fixed. For example, the securing of the support may becarried out before or after the introduction of the passage. It is alsopossible for the introduction of the passage to be carried out in aplurality of steps. In this case, the support may also be securedbetween two of these introduction process steps.

It is particularly preferable for at least one of the steps of securingthe support or of introducing at least one conductive passage to becarried out while the components are still joined to the wafer. Thisallows particularly economic production of MEMS modules. Moreover,securing the support results in at least partial packaging of themodules in the wafer assembly, corresponding to a wafer level packaging.

The conductive passage can advantageously be used to create inparticular a through electrical contact to the electrical connection ofthe micromechanical components from the opposite side of the substrate.In this way, bulky contacts which disrupt the function of the componentcan be avoided on the side of the substrate which has themicromechanical components.

The introduction of the electrically conductive passage may be carriedout in various ways, and the different processing options can also beselected as a function of the material used for the substrate.

In particular, the step of introducing the conductive passage maycomprise the step of producing a recess by removing substrate material.

The recesses can be produced using various processes, depending on thesubstrate material. By way of example, such recesses can be produced bymeans of a dry-etching process. By way of example, in particular ananisotropic dry-etching process, such as for example the “ASE process”,which is based on SF₆ radicals, is particularly suitable for siliconsemiconductor substrates. Various wet-etching processes, such as forexample anisotropic etching using KOH solution, which is recommended forSi wafers with a (100) orientation, are also suitable for suchsemiconductor substrates. Grinding or ultrasonic lapping can also beused to produce recesses.

Moreover, in the process the step of introducing the conductive passagemay comprise the step of filling the passage with an electricallyconductive material.

The material used may, inter alia, be a conductive epoxy. Filling withan epoxy of this type represents a variant of the process which issimple to carry out. To make it possible to produce a conductive passagewith a particularly low electrical resistance, it is advantageous if theconductive material comprises a metal which is deposited in the recessby electrodeposition.

Electrically conductive connections can also be produced by means ofdoping or ion implantation, so that it is unnecessary for the substratematerial to be removed, at least for the doped regions.

Particularly in order to create a connection between themicroelectromechanical element and the electrically conductive passagefor the through-contact, it is advantageous if the process additionallycomprises the step of producing at least one electrical contact surface.The electrically conductive passage may be in direct contact with thecontact surface or may be connected to the latter via an electricalconnection, such as for example an interconnect.

It is preferable for the contact surface to be produced on the firstside of the substrate.

Furthermore, the substrate can advantageously be thinned. This has theresult, inter alia, that the depth required for the conductive passagecan be reduced. In this context, it is particularly advantageous if thethinning of the substrate takes place after the securing of the support.Since the support joined to the substrate imparts additional strength tothe substrate, in this way the substrate can be thinned further withoutimposing excessive mechanical loads on the substrate and therebydestroying it, which would be possible without a secured support. By wayof example, according to a preferred embodiment of the process, thesubstrate is adhesively bonded to the support, for example a thin glassdisc, on the first side. As a result, the micromechanical elements onthe substrate are protected and the arrangement acquires additionalstability. A suitable epoxy resin can generally be used as the adhesive.The substrate can then be mechanically thinned on the back surface bymeans of a grinding process, the mechanical stability still beingensured by the support.

Electrically conductive passages can be produced, inter alia, with theaid of thinning the substrate by grinding as a result of the first sideof the optical chip being photolithographically patterned and recessesbeing introduced in the form of etching pits. In this variant, theconductive passages are preferably located next to the contact surfacesor bonding pads for connection of the microelectromechanical elements.The etching pits are then filled with a conductor and an interconnect isapplied from the etching pit to the bonding pad. Then, the transparentcover can be applied and after that the wafer is thinned on the backsurface until the conductive fillings of the etching pits project on thesecond side.

The substrate may comprise a wide range of suitable materials. Inaddition to the semiconductor materials which are customary for MEMSmodules, the substrate may also comprise glasses, metals, ceramics,piezo-electric materials, plastics or composite materials.

Moreover, the process can advantageously be refined further by producinga structured support. The structuring may take place completely orpartially in the state in which the support has already been joined tothe substrate or separately therefrom.

The structuring of the support may advantageously comprise theintroduction of at least one structure which forms a cavity and/or athrough-opening. The cavity may, for example, be used to receive fluidsor may also surround projecting parts of the microelectromechanicalelements on the substrate. A through-opening can be used, for example,to produce a connection between the microelectromechanical elements andthe environment, so that, for example, light can impinge on themicromechanical components without being impeded.

Moreover, the support can be structured in such a way that it comprisesat least one trench, in particular a V-groove, the trench preferablyextending in a direction along the surface of the support. Such trenchescan be used, inter alia, to receive optical fibres.

In general terms, a mechanical fit in or on the support can be createdby means of the structuring. Therefore, an element which is introducedinto the fit can be introduced at a precise orientation with respect tothe substrate and/or the micromechanical elements. A fit of this type issuitable in particular for optical elements, such as for examplewaveguides, optical lenses or prisms.

However, mechanical fits are not the only option for joining the opticalelements to the support. Rather, it is also possible for the supportitself to be structured in such a way that it has optical components.Integrated optical elements of this type may, for example, compriselenses or gratings.

For certain MEMS applications it may also be advantageous if the step ofstructuring the support comprises the step of producing a spacer, inparticular for at least one optical element and/or at least one furthersupport. Spacers can be used, for example, to increase the focal lengthof lenses and thereby reduce their image errors. However, a spacer mayalso be of benefit for other components and other purposes. By way ofexample, the spacer may also create a defined spacing from a furthermicromechanical component.

According to the invention, MEMS modules for more complex applicationscan advantageously be produced, inter alia, if, in addition, the step ofproducing a structured support comprises the step of producing areceiving part, in particular for fluids and/or optical elements and/orpiezo-electric elements and/or micromechanical elements and/orelectronic components. This refinement of the production process createsthe possibility of integrating a wide range of functions in parallel inan MEMS component.

For certain applications, MEMS elements may also be located on oppositesides of the substrate. For structures of this type, it may beparticularly advantageous if there is a connection between thestructures on opposite sides. Therefore, the process may additionallycomprise the step of introducing further passages which produce afunctional connection between the structures. For this purpose, by wayof example, light-conducting, fluid-conducting or heat-conductingpassages are particularly suitable.

According to a preferred embodiment of the process according to theinvention, the at least one conductive passage is introduced from thefirst side of the substrate, and the support is secured after the atleast one conductive passage has been introduced.

According to a further preferred embodiment, the at least one conductivepassage is introduced from the second side of the substrate. In thiscase, the cover can be secured before or after the introduction of thepassage.

To secure the MEMS module either on a circuit board or on a furthersubstrate and to produce the required electrical contact with themodule, the process may in addition comprise the step of applying asoldering bead to the at least one conductive passage. If there is amultiplicity of electrical connections with corresponding associatedconductive passages for making contact through the substrate, in thisway a ball grid array is produced on the second side of the substrate.

Moreover, the through-contact which is created by means of theconductive passage which has been introduced into the substrate resultsin the particularly advantageous possibility of adding furthersubstrates. For example, the substrates may comprise integratedsemiconductor circuit arrangements or substrates with further MEMSelements. Therefore, the process according to the invention makes itpossible to produce three-dimensional MEMS systems or three-dimensionalMEMS modules.

It is also within the scope of the invention to provide amicroelectromechanical component which is produced in particular usingthe inventive process described above, the microelectromechanicalcomponent having a substrate having a first side and a second side whichis substantially opposite from the first side, and the first side of themicroelectromechanical component comprising at least one micromechanicalelement. The substrate additionally has at least one electricallyconductive passage connecting the first side to the second side.

In a particularly preferred embodiment of the component, the latter hasa support which is connected to the first side of the substrate. Thesupport protects the microelectromechanical elements from harmfulenvironmental influences, such as for example from the risk ofmechanical damage.

The cover of the component may have at least one optical element, inparticular a prism and/or a grating and/or a lens and/or an opticalfilter. Therefore, certain optical functions may already advantageouslybe integrated in the component for optical applications, with the resultthat, for example, it is also possible for an overall structure of anoptical system with MEMS component to be produced in a more compactdesign.

Moreover, the support may have at least one cavity and/or athrough-opening, for example in order to be able to receive or carryfluids.

The support may advantageously also have at least one fit. Such a fitallows precise orientation of elements which are held therein. By way ofexample, the fit may be suitable for receiving an optical element, inparticular a lens and/or a waveguide and/or a grating and/or a prism.

In addition to such fits, the support may also comprise at least onereceiving part. Inter alia, a circuit arrangement and/or apiezo-electric component and/or an active or passage electronic elementmay be accommodated in the receiving part. In this way, it is possiblefor additional functions to be integrated in the component. By way ofexample, an electronic circuit which provides the voltages required toactuate the microelectromechanical elements may be accommodated therein.In this way it is also possible, for example, to accommodate active orpassive electronic filter elements which can be used, for example, tostabilize the control voltages of a microelectromechanical element.

In a particularly simple form, the support may be joined to thesubstrate by adhesive bonding, in particular by means of epoxy resin.

In particular, the support may also have a plurality of layers. Thesecan be used, inter alia, to increase the strength. It is also possiblefor various functional structures to be combined with one another on andwithin the support by using a combination of a plurality of layers. Forexample, it is in this way possible for multiple-element optics to beintegrated in the support.

The through-contact produced by the conductive passages can be used inparticular also to produce a component which includes a plurality ofsubstrates stacked on top of one another. In addition to stackedsubstrates with MEMS elements, it is also possible, by way of example,for substrates with integrated electronic circuits to be combined withthe first substrate. Depending on their function, the individualsubstrates may also comprise different materials. For this purpose, onesuch multilayer component comprises at least two substrates which arearranged one above the other, the further substrate having at least oneconnection contact and electrical contact being produced between the atleast one electrically conductive passage of the substrate and theconnection surface of the at least one further substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention is to be explained in more detail below on the basis ofembodiments and with reference to the appended drawings, in whichidentical reference numerals in the individual drawings denote identicalor similar components. In the drawings:

FIGS. 1A to 1E: show the process steps involved in the production of amicroelectromechanical component in accordance with a first embodimentof the process according to the invention with reference tocross-sectional views through a wafer,

FIGS. 2A to 2B: show a variant of the process steps illustrated withreference to FIGS. 1D and 1E,

FIG. 2C: shows a cross-sectional view through an MEMS module which hasbeen separated from the wafer,

FIGS. 3A to 3D: show the process steps involved in the production of amicroelectromechanical component in accordance with a further embodimentof the process according to the invention with reference tocross-sectional views through a wafer, and

FIG. 4: shows an MEMS module with a multilayer, structured support andsubstrates stacked on top of one another.

DETAILED DESCRIPTION OF THE INVENTION

In the following text, reference is made first of all to FIGS. 1A to 1E,which use cross-sectional views through part of a substrate wafer 1 toillustrate the process steps involved in the production of amicroelectromechanical component in accordance with a first embodimentof the process according to the invention.

The process steps which are explained below are carried out while thecomponent is still joined to the wafer in the present exemplaryembodiment. The wafer 1 has been provided with microelectromechanicalstructures 5 by the time the processing phase illustrated in FIG. 1A isreached. On the wafer 1 there is a multiplicity of dice 11, 12, 13, ofwhich the die denoted by 11 is illustrated in full. The individualmicroelectromechanical components are obtained after separation of thedice 11, 12, 13 in the wafer assembly. In order for voltage to besupplied, the microelectromechanical elements 5 are connected to contactsurfaces 3. Contact surfaces and microelectromechanical structures aresituated on the first side 2 of the substrate 6 of the wafer 1. It isnow an object of the invention to produce electrical contact on thesecond side 4 of the substrate 6, in order to achieve a particularlyspace-saving arrangement of the elements of an MEMS component and thepossibility of stacking with further substrates.

In this connection, FIG. 1B shows a further processing step. Recesses 7have been introduced into the substrate 6. These recesses can beintroduced into the substrate by means of a suitable etching procedure,for example. Inter alia anisotropic etching of an Si(100) substrateusing KOH is suitable for the production of the etching pits; in thiscase, etching pits with an aperture angle of approximately 70° areformed. The introduction of the recesses is independent of theproduction of the microelectromechanical elements and of the contactsurfaces. Therefore, the order in which these processing steps arecarried out is not binding.

Then, in a subsequent processing phase, as shown in FIG. 1C, electricalconnections 9 are produced between the recesses 7 and the contactsurfaces 3. To produce the contacts, the etching pits 7 and regions ofthe first side 2 between the etching pits 7 can be coated with a metal.In this way, a metal layer is formed as electrical connection 9 which islocated on the walls of the etching pits and on regions between theetching pits, the layer at least partially covering the contact surfacesin order to produce a reliable contact. By way of example, aluminium isa suitable contact-making metal.

Then, the metal-coated recesses 7 are filled with a conductive material,as shown with reference to FIG. 1D, so that there are fillings 15 in therecesses 7.

In this exemplary embodiment, the recesses 7 do not extend through thesubstrate 6. Therefore, in the processing phase shown in FIG. 1D, theydo not yet form conductive passages which connect the first side 2 tothe second side 4. To produce these passages, in a further processingstep which is illustrated in FIG. 1E, the wafer 1 can be ground from thesecond side 4 so as to reduce its thickness until the conductivematerial of the fillings emerges on the second side 4 and forms contactsurfaces 17. The recess 7 which has been filled with the filling 9therefore forms an electrically conductive passage which connects thefirst side 2 of the substrate 6 to the second side 4.

FIGS. 2A and 2B show a variant of the process steps which have beenshown with reference to FIGS. 1D and 1E. The process differs to theextent that a support 19 is secured to the first side 2 of the substrate6. By way of example, for optical MEMS applications, the support 19 maycomprise a transparent wafer, so that light can impinge on the MEMSelements 5. The support 19 is also structured in such a way that acavity 21 is formed when it has been joined to the wafer 1. By way ofexample, the cavity creates a hermetic seal of the MEMS elements 5without restricting their mobility. On the other hand, the cavity 21 canalso be designed to receive and carry fluids. The support may, forexample, be adhesively bonded to the substrate 6, so that there is anadhesive bond 20 between support 19 and first side 2 of the substrate 6.

Moreover, the support 19 provides the overall structure with additionalmechanical strength. In particular, the wafer 1 is mechanicallysupported by the support. The result of this is that the wafer 1 can beground until it is thinner than is the case with an unsupported wafer asshown in FIG. 1E. the thinning processing step is shown in FIG. 2B. Thesecuring of the support in this context offers the additional advantagethat the sensitive MEMS elements 5 are protected from damage during themachining.

In addition, in the processing phase shown in FIG. 2B, soldering beads23 have been applied to the contact surfaces 17 of the conductivepassages 8, in order to be able to produce an electrical connection, forexample to a circuit board or a further module. The soldering beads forma ball grid array on the wafer 1.

FIG. 2C shows a cross-sectional view through an MEMS module 27 which isobtained from a wafer assembly as shown in FIG. 2B after furtherprocessing steps. The module is produced by dicing or separating thedice 11 from the wafer 1.

To produce a housing which completely surrounds the module 27, themodule is additionally provided with an encapsulation 25. Theencapsulation may be made, for example, from an epoxy resin. On thatside of the module on which the soldering beads 23 are located, theencapsulation can be partially ground away again, so that the solderingbeads are partially uncovered. This allows subsequent soldering toanother component by melting the soldering beads which have beenpartially ground away.

FIGS. 3A to 3E show the processing steps involved in the production ofan MEMS module in accordance with a further embodiment of the invention.In this embodiment of the process too, the processing steps are carriedout while the module is still joined to the wafer.

The processing state of the wafer shown in FIG. 3A substantiallycorresponds to that of the wafer illustrated in FIG. 1A. By way ofexample, an electromechanically adjustable reflector arrangement isillustrated as microelectromechanical element 5 in FIG. 3A. In thisembodiment too, the microelectromechanical elements 5 of the dice are ineach case connected to one or more contact surfaces 3 for electricalsupply.

FIG. 3B shows the wafer assembly after the wafer 1 has been joined to astructured support 19. In this case, the support 19 has athrough-opening 29. In addition to the through-opening, the support 19also comprises a mechanical fit 31. The mechanical fit is suitable forreceiving a lens 33. The lens focuses light onto the reflector of themicroelectromechanical element 5. The illustrated structuring of thesupport and the lens which has been introduced into the fit are onlyexamples. In fact, the support may also be advantageously structured ina wide range of other ways. The structuring may take place both beforethe joining and partially or completely in the state in which thesupport has already been joined to the substrate 6.

FIG. 3C shows the wafer assembly after the introduction of recesses 7.By contrast with the processes which have been explained with referenceto FIGS. 1A to 1E and 2A to 2C, in this embodiment of the process theconductive passage will be introduced from the second side 4 of thesubstrate 6. For this purpose, recesses 7 which lie opposite the contactsurfaces on the first side 2 of the substrate are introduced from thesecond side 4, as shown in FIG. 2C. The recesses extend as far as thecontact surfaces 3.

FIG. 3D shows the wafer assembly after fillings 15 of the conductivematerial have been introduced into the recesses 7. The conductivefillings, which are in electrical contact with the contact surfaces 3,create a conductive passage 8 which connects the first side 2 to thesecond side 4 of the substrate 6. Contact surfaces 17 are in turncreated on the second side 4 by the introduction of the fillings 15.These contact surfaces 17 may in turn be provided with soldering beads23 for electrical connection of the MEMS structures 5. Moreover, thewafer 1 has once again been provided on the second side 4 with anencapsulation 26, resulting substantially in wafer level packaging. Theencapsulation may consist, for example, of a plastics material, such asfor example an epoxy resin. To make the soldering beads accessible againfor subsequent contact to be made, the encapsulation may be partiallyground away, until the soldering beads are partially uncovered at thesurface, before the dice are separated from the wafer 1 or from thewafer assembly comprising wafer 1 and support 19.

The following text refers to FIG. 4, which shows an MEMS module withmultilayer, structured support and substrates stacked on top of oneanother, in a cross-sectional illustration. The MEMS component comprisesa substrate 6 which has been processed in accordance with the processsteps which have been shown with reference to FIGS. 3A to 3D. Bycontrast, however, the embodiment shown in FIG. 4 comprises a multilayersupport 19. The support 19 is composed of the layers 191, 192, 193 and194. The layers 191 and 193 each have a through-opening 29. Betweenthese layers there is a layer 192 which is structured in such a way thatit includes an optical element, in this exemplary embodiment anintegrated optical lens 37. The layers 191 and 193 serve as spacers forthe lens 37 and for the layer 194, which includes mechanical fits 31 forwaveguides 39.

Moreover, during the production of the MEMS components while they arestill joined to the wafer, a further substrate 35 was secured to thesubstrate 6. The further substrate 35 comprises an active layer 37 withintegrated semiconductor circuits. These can be used, for example, toactuate the MEMS elements 5. Alternatively, in this way stacking withone or more MEMS modules is also possible.

The further substrate 35, like the substrate 6, has contact surfaces 3.In this case, contact is made with the MEMS elements 5 via thethrough-contact produced by means of the conductive passages 8 in thesubstrate 6 and the soldering beads 23 which have been arranged on thepassages 8 and are soldered to the contact surfaces 3 of the furthersubstrate 35. The contact surfaces 3 of the further substrate 35 are inturn connected in the same way, as described above, to the opposite sideof the further substrate 35 via electrically conductive passages 8. Itis also possible for the contacts for supplying power to the activelayer 37 to be laid on the opposite side of the substrate 35. In thisway, all the electrical contacts of the stacked component are on theopposite side from the waveguides. The side of the component 27 fromwhich the waveguides are supplied therefore remains completely free ofdisrupting bonding wires or other contacts of the component.

Once again, soldering beads have been applied to the conductive passages8 of the further substrate. An encapsulation or packaging of the parts6, 35 and 191 to 194 which have been joined while still part of thewafer may be effected in the same way as has been explained withreference to FIG. 2C, by applying an encapsulation layer 26 to the sideof the substrate 35 which has the soldering beads and then grinding theencapsulation layer 26 away again until the soldering beads project onthe surface which has been ground down.

1. A process for producing microelectromechanical components from asubstrate having a first side and a second side which is substantiallyopposite from the first side, at least the first side having at leastone microelectromechanical element, comprising the step of providing atleast one electrically conductive passage into the substrate, connectingthe first side to the second side, and the step of securing at least onesupport to the first side of the substrate, wherein the at least oneelectrically conductive passage is uncovered by thinning the substratematerial with the mechanical stability being ensured by means of thesupport.
 2. The process according to claim 1, wherein the step ofsecuring comprises at least one of the steps of securing the support andof introducing at least one electrically conductive passage that takesplace while the components are still joined to the wafer.
 3. The processaccording to claim 1, wherein the step of providing the at least oneelectrically conductive passage comprises the step of producing a recessby removing substrate material.
 4. The process according to claim 3,wherein the step of removing the substrate material is selected from agroup consisting of dry-etching, wet-etching, grinding and ultrasoniclapping.
 5. The process according to claim 3, further comprising thestep of filling the recess with a conductive material.
 6. The processaccording to claim 5, wherein the conductive material comprises aconductive epoxy.
 7. The process according to claim 1, wherein the stepof providing the at least one electrically conductive passage comprisesthe step of at least one of doping and ion implantation.
 8. The processaccording to claim 1, further comprising the step of producing at leastone electrical contact surface.
 9. The process according to claim 8,comprising the step of producing a contact surface on the first side ofthe substrate.
 10. The process according to claim 1, in which thesubstrate is selected from a group consisting of a semiconductormaterial, a glass, a metal, a ceramic material, a piezo-electricmaterial, a plastic and a composite material.
 11. The process accordingto claim 1, further comprising a structuring step in which thestructuring step comprises the step of introducing at least onestructure which forms at least one of a cavity and a through-opening.12. The process according to claim 1, further comprising a step ofstructuring the support in which the step of structuring the supportcomprises the step of producing at least one trench, the trenchextending in a direction along a surface of the support.
 13. The processaccording to claim 1, further comprising a step of structuring thesupport in which the step of structuring the support comprises the stepof producing a mechanical fit.
 14. The process according to claim 13, inwhich the mechanical fit is suitable for receiving an optical element.15. The process according to claim 13, in which the mechanical fit issuitable for receiving at least one of a waveguide and an optical lensand a prism.
 16. The process according to claim 1, further comprising astep of structuring the support in which the step of structuring thesupport comprises a step of producing a support which includes opticalcomponents.
 17. The process according to claim 16, in which the step ofproducing a support which includes optical components comprises the stepof producing at least one of optical lenses and gratings.
 18. Theprocess according to claim 1, further comprising a step of structuringthe support in which the step of structuring the support comprises thestep of producing a spacer.
 19. The process according to claim 1,further comprising a step of producing a structural support, in whichthe step of producing a support comprises the step of producing areceiving part.
 20. The process according to claim 1, further comprisingthe step of introducing at least one of a light-conducting,fluid-conducting and heat-conducting passage into the substrate.
 21. Theprocess according to claim 1, wherein the at least one electricallyconductive passage is introduced from the first side of the substrate,and wherein the support is secured after the at least one conductivepassage has been introduced.
 22. The process according to claim 1,wherein the at least one conductive passage is introduced from thesecond side of the substrate.
 23. The process according to claim 1,further comprising a step of applying a soldering bead to the at leastone conductive passage.
 24. The process according to claim 1, comprisingthe step of securing at least one further substrate to the substrate.25. The process according to claim 1, further comprising a step ofstructuring the support, in which the step of structuring the supportcomprises the step of producing at least one V-groove, the V-grooveextending in a direction along a surface of the support.
 26. The processaccording to claim 1, further comprising a step of structuring thesupport, in which the step of structuring the support comprises the stepof producing a spacer for at least one of an optical element and afurther support.
 27. The process according to claim 1, furthercomprising a step of producing a support, in which the step of producinga support comprises the step of producing a receiving part for at leastone of fluids, optical elements, piezo-electric elements,micromechanical elements and electronic components.
 28. The processaccording to claim 1, comprising the step of securing at least onefurther substrate to the substrate, which comprises at least one ofintegrated semiconductor circuit arrangements and MEMS elements.
 29. Amicroelectromechanical component comprising a substrate having a firstside and a second side which is substantially opposite from the firstside, at least the first side comprising at least onemicroelectromechanical element and at least one support which isconnected to the first side of the substrate, wherein the substrate hasat least one electrically conductive passage, connecting the first sideto the second side and wherein the substrate is thinned, the mechanicalstability of the thinned substrate being ensured by means of thesupport.
 30. The component according to claim 29, wherein the supporthas at least one optical element.
 31. The component according to claim29, wherein the support has at least one of a cavity and athrough-opening.
 32. The component according to claim 29, wherein thesupport has at least one fit.
 33. The component according to claim 32,wherein the fit is suitable for receiving an optical element.
 34. Thecomponent according to claim 32, wherein the fit is suitable forreceiving an optical element selected from a group at least consistingof a lens 5), a waveguide, a grating and a prism.
 35. The componentaccording to claim 29, in which the support has a receiving part. 36.The component according to claim 35, in which the receiving part isadapted to receive at least one of a circuit arrangement, apiezo-electric component and an active or passive electronic element.37. The component according to claim 29, wherein the support isadhesively bonded to the substrate.
 38. The component according to claim29, wherein the support has a plurality of layers.
 39. The componentaccording to claim 29, comprising at least one further substrate, thesubstrate and the at least one further substrate being arranged aboveone another.
 40. The component according to claim 39, wherein the atleast one further substrate has at least one connection contact, and theconductive passage is in electrical contact with the connection contact.41. The component according to claim 29, wherein the support has atleast one optical element selected from a group consisting of a prism, agrating, a lens and an optical filter.
 42. The component according toclaim 29, wherein the support is adhesively bonded to the substrate byan epoxy resin.